Overview

Job Description Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern designs use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. You will join an inclusive, forward-thinking team dedicated to building technologies that power virtual reality, neural networks, and next generation computing. In this role, you will own design for test (DFT) solutions for complex high bandwidth memory (HBM) system on chip (SoC) base die designs. Your work will directly enable manufacturability, quality, and successful silicon bring up across current and future HBM generations. (LLM) Responsibilities will include, but are not limited to: Own SoC-level DFT structures and their implementation. This includes scan, memory built-in self-test (MBIST), logic built-in self-test (LBIST) where applicable, boundary scan (JTAG), and test access architectures for HBM base-die builds. Define and drive DFT architecture early in the design cycle, ensuring alignment with SoC integration, floorplanning, timing, power, and physical design requirements. Implement and integrate DFT logic at block, subsystem, and full chip levels while partnering closely with register transfer level (RTL) design and SoC integration teams. Complete and sign off DFT flows, including linting, clock domain crossing (CDC) checks, DFT rule checks, automatic test pattern generation (ATPG) readiness, and coverage closure. Collaborate with physical design teams to optimize DFT solutions for placement, routing, timing closure, and design rule check/layout versus schematic (DRC/LVS) signoff. Work with verification, product engineering, test, probe, and manufacturing teams to ensure testability, diagnosability, smooth pre silicon debug, and post silicon bring up. Partner with computer aided design (CAD) and methodology teams to standardize and improve DFT flows, contribute to cross group technical reviews, mentor engineers as appropriate, and drive innovation for future HBM generations. Minimum Qualifications: Strong hands on experience with SoC develop for test (DFT) architecture and implementation, including scan insertion, MBIST/LBIST concepts, boundary scan (JTAG), and ATPG. Experience working across full RTL to GDS SoC flows and collaborating with synthesis, static timing analysis (STA), and physical design teams. Proficiency using industry standard electronic design automation (EDA) tools from Siemens, Synopsys, and/or Cadence for DFT and implementation. Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience. Seven or more years of relevant experience in SoC design, DFT, or implementation for complex digital application specific integrated circuits (ASICs) or SoCs. Preferred Qualifications: Experience with large, complex SoCs that integrate multiple intellectual property (IP) blocks and subsystems. Strong RTL debugging, design analysis, and problem solving skills. Experience using scripting languages such as Python, Tcl, or Perl for flow automation. Familiarity with memory systems such as dynamic random access memory (DRAM), high bandwidth memory (HBM), and related JEDEC specifications. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $146,000.00 - $247,000.00 a year Additional compensation may i