Overview

RELOCATION ASSISTANCE: Relocation assistance may be availableCLEARANCE REQUIRED FOR START: YesCLEARANCE TYPE: SecretTRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.At the heart of Defining Possible is our commitment to missions. In rapidly changing global security environments, Northrop Grumman brings informed insights and software-secure technology to enable strategic planning. We're looking for innovators who can help us keep building on our wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies that fuel those missions. By joining in our shared mission, we'll support yours of expanding your personal network and developing skills, whether you are new to the field, or an industry thought leader. At Northrop Grumman, you'll have the resources, support, and team to do some of the best work of your career.Northrop Grumman Mission Systems is seeking a Staff Electromechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Linthicum, Maryland and will require 100% on-site work.What You'll Get to Do: Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologiesCollaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.Providing technical leadership and mentoring to less experienced personnel.This position is contingent upon contract award, and the ability to obtain an active US Government Secret Clearance or the successful transfer of an active US Government Secret Clearance prior to start.Basic Qualifications:Bachelor's degree with 12 years of experience, a master's degree with 10 years of experience or a PhD with 8 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.; will consider 4 years of applied experience in lieu of degree requirement.U.S Citizenship required.The ability to obtain/maintain an active US Government Secret clearanceA current/active clearance is not required to be considered for the position, but a final clearance is required to start Minimum 12 years of professional experience in PWB/CCA design and signal routing, including chip-scale packaging technologies and substrate/PWB layout. Minimum 12 years of professional experience applying materials, specifications, manufacturing processes, and design tools used for multi-chip modules, PWBs, and CCAs. Minimum 12 years of professional experience using AutoCAD, Xpedition, or both for design and layout activities. Minimum 12 years of professional experience using NX or comparable 3D modeling software. Preferred Qualifications:Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineer