Overview

Job Description Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative designs are pushing the boundaries of what's possible in the future of semiconductors. We are seeking a motivated Process Integration Engineer to join our BEOL (Back-End-Of-Line) team within DRAM Research & Development. This role is ideal for recent graduates or early-career engineers who are eager to develop deep expertise in semiconductor process integration, metallization, and interconnect technologies. You will work alongside experienced integration engineers to develop, optimize, and transfer advanced DRAM BEOL process flows. Strong fundamentals in materials science, electrical engineering, or a related discipline are essential. Prior semiconductor experience is valued but not required - we invest in developing our engineers. Responsibilities Support BEOL process flow development, optimization, and integration for advanced DRAM technologies. Assist in troubleshooting integration issues across multiple process modules (metallization, dielectrics, etch, CMP). Collect, analyze, and interpret process and electrical data to drive yield improvement and reliability enhancement including the use of Agentic AI modeling Collaborate with cross-functional teams (module engineers, device engineers, reliability, manufacturing) to resolve technical challenges. Participate in technology transfer activities from R&D to pilot production. Document findings and present results to peers and leadership. Learn and apply statistical analysis tools and methodologies (JMP, Python, R, or equivalent). Support pathfinding efforts for next-generation BEOL architectures and materials. Minimum Qualifications: MS/PhD (preferred)/BS (required) in Electrical Engineering, Materials Science, Chemical Engineering, Microelectronics, Physics, Chemistry, or related field along with coursework or research in thin films, interconnect technology, or nanofabrication. Foundational understanding of semiconductor fabrication processes (thin film deposition, etch, lithography, CMP). Familiarity with BEOL concepts: metallization, interconnects, dielectrics, barrier/liner films. Hands-on experience with deposition techniques (CVD, ALD, PVD) or etch processes. Exposure to DRAM or memory device technology paired with experience with process integration, yield improvement, or reliability testing. Preferred Qualifications Internship or co-op experience in a semiconductor fab or R&D environment. Willingness to learn, adapt, and work in a fast-paced R&D environment paired with proficiency in statistical analysis tools: AI tool such as Claude Code etc Familiarity with characterization techniques: SEM, TEM, XRD, electrical testing. Experience with DOE (Design of Experiments) methodology. Knowledge of semiconductor reliability concepts (electromigration, TDDB, stress migration). As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants