Overview

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.Responsibilities:Develop, diagnose, and resolve various die bonding process technologiesCoordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process stepLead and participate in continuous yield improvement and cost reduction activitiesValidate and fan out new process baseline qualified, including new process, tools and/or materials for new product introductionManage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectivesSupport SPC/FDC/RMS/APC and site-to-site portabilitySupport internal and external auditsMinimum Qualifications:A BS degree with minimum 8+ years proven experience in Semiconductor Process EngineeringSolid engineering knowledge of semiconductor advanced packaging die stacking processesSkilled at designing valid tests and Design of Experiments (DOE)Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programsExcellent oral and written communication skills and a strong attention to detailHighly self-motivated and have the ability to work independently, as a group leader, and as a collaborative contributorKnowledge and an understanding of project managementPreferred Qualifications:Masters or Doctorate degree in Engineering, Physics, or related fieldExperience in working on Die Bonding : Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous IntegrationBonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on . Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race